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Polymatech debuts next-gen COB LED solutions at Light + Building 2026, Hall 8 Booth E39, Frankfurt.
Polymatech Electronics, a leader in semiconductor and optoelectronic technologies, is set to unveil its latest advancements in Chip-on-Board (COB) LED solutions at Light + Building 2026, the world’s premier trade fair for lighting and building services technology. The event is being held in Frankfurt, Germany, from March 8 to 13, 2026.
At Hall 8, Booth E39, visitors will have the opportunity to explore Polymatech’s next-generation COB LED technologies. These solutions are engineered to provide high luminous efficacy, superior thermal management, and exceptional color consistency, making them suitable for a wide range of applications, including:
The company’s advancements highlight its dedication to precision semiconductor engineering and application-driven innovation. By addressing the evolving demands of global lighting manufacturers, Polymatech demonstrates a strong commitment to pushing the boundaries of solid-state lighting technology.
Attendees of Light + Building 2026 will have the opportunity to engage with Polymatech’s team of experts, who will be available to discuss collaboration opportunities and customized LED solutions. Company representatives at the event include:
Polymatech’s COB LED solutions reflect the company’s expanding capabilities in advanced semiconductor packaging and LED technologies. With a focus on high-performance, energy-efficient systems, the company continues to serve as a trusted partner for professionals in the lighting industry.
Industry professionals attending Light + Building 2026 are encouraged to visit Polymatech at Hall 8, Booth E39 to experience these latest innovations and explore potential collaborations.
